The restructuring events database contains factsheets with data on large-scale restructuring events reported in the principal national media and company websites in each EU Member State. This database was created in 2002.
Manufacturing Manufacture of electrical, electronic and optical products Manufacture of computer, electronic and optical products 26.11 - Manufacture of electronic components
100 - 1,800 jobs Number of planned job losses
Announcement Date
22 May 2025
Employment effect (start)
22 May 2025
Foreseen end date
30 June 2035
Description
NXP Semiconductors, a leading global chip manufacturer, has announced plans to cut up to 1,800 jobs worldwide.
The company is to close four of its 8-inch (200mm) wafer fabrication plants - one in the Netherlands and three in the United States - as part of a strategic shift toward advanced 12-inch (300mm) wafer production. The closures are part of a broader modernisation strategy to improve efficiency, reduce costs, and increase margins by transitioning to state-of-the-art manufacturing technologies. The Nijmegen plant in the Netherlands, with about 1,7000 employees, is expected to be gradually phased out over a transition period of up to ten years, with existing processes transferred to new facilities. The three US factories will follow a similar timeline for closure.
The decision is driven by the limitations of 200mm wafer technology, which yields significantly fewer chips compared to 300mm wafers. NXP is investing in new joint-venture fabs in Singapore and Germany, scheduled for production by the end of 2027. These new sites will serve as manufacturing hubs for the Asia-Pacific and European regions, respectively.
NXP operates in more than 30 countries and employs about 34,000 people worldwide.
Eurofound (2025), NXP Semiconductors, Closure in World, factsheet number 203000, European Restructuring Monitor. Dublin, https://dev.eurofound.europa.eu/restructuring-events/detail/203000.
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